The analysis of heat transfer in the rotational moulding process is a non-linear multi-dimensional matter, which involves a number of process conditions and thermal parameters. The present study mostly involves dimensional analysis, the changing effects of the process parameters and conditions on the process times for different processing circumstances. They have been explored and compared by using the two-dimensional slip flow model from Lim and Ianakiev. The modelling helps to further identify and understand the dependence of the key thermal parameters due to external heating, external cooling, external-internal cooling and warpage on cycle times of the rotational moulding. In addition, the detail of the coincident node technique is discussed to present the key components of the conductivity matrix for an element 'abutting' a coincident node interface.
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